Input matching for GSM PA design

Whether the input matching and output matching are off chip or not?To bring down input VSWR,I have to place two indcutors off the chip,one in series,the other is shunt,but I thought it cost too much space in the module,

I also tried this method:use an inductor(bond wire) in series with the emmiter for feedback,which can increase Zin,however it's not enough becase of the little inductance.

Can anyone give some suggestions about the input matching?or some ADS prj about GSM PA,

Thanks in advance!

do u design the module by urself , or it is ready , and u need to match it

khouly

I design the GSM PA chip except the power controller by myself,and package them in a module,
Does anyone have experiences of GSM PA design?

The trend today in GSM PA design is to integrate both, the input and output matching components.
To integrate the output matching components could be a challenge, trying do not sacrifice efficiency and output power.
The last stage choke inductor, and also some of the inductors part of the input/output match could be realized using bond-wires. There are a lot of GSM PA?s on the market that use this approach.
Beware that series bond wire on the emitter could damage the efficiency of the PA.
The bias of each stage is also very important for this PA.