0.18um IBM and Dong-Bu(Korean) model

Dear all,

Could anyone provide some RF characterization document of CMOS 0.18um IBM and Bong-Bu foundry? Such as (i) how many metal and poly layers? (ii) TWIN or TRIP_WELL? (iii) provide RF ESD pad? (iv) what is ft and fmax? (v) with MIM?

Thanks

wccheng