bump cell是什么？

不是所有的模块都要bump的，只有像GPIO这类的I/O模块才需要。
可以吧bump理解为芯片的引脚吧。

bump is a IO connect pad, it's connect IO pad and ball pad.
It's used in flip-chip flow

In IC design, it's only used in flip-chip flow.
I always treat it as a piece oftop level metal.
Internally it will be routed to IO cells, externally it will be connected to solder ball and hence to the package

受教了。
是不是QFP这种就不用bump了?因为没有ball pad么

对的，QFP没有bump