RF PA package problem

I'm designing a RF PA module with LGA package.which laminate is suitable for RF PA packing in 900MHz,1800MHz when the max output power is 1W? What experiments should be done for testing the reliability of the module?

Pretty much any laminate is ok, probably even G10 board although it would be a little lossy. The key is to get the heat out of the device! The device manufacturer probably shows which ground pins are used under. The ones that are under the center of the package are for heat transfer. Make sure they are plated thru holes that go go a big metal ground plane somewhere on board. If you are operating in a hot environment, you might wish to glue a heatsink onto the bottom of the board, or make the bottom of the board underneath the chip touch a bump-out from the metal housing.