Bondingwire inductor in VCO design ?

Dear All :

I am looking for Bonding wire inductor of VCO design ? Does anyone know how to do it ? Any document ? If I use cadence flow, Does any example of cadence tools support it ? Thanks

some time back i was reading an article in Nikkei Asia, where one company had used the bonding wire as an inductor in a Single chip Tuner design. i will try to find that article.

the bond wire from PAD to PKG is inductor. You may use it in your design, Be carefully calculate and test the inductance. It is nH level and useful in GHz circuits.

If your circuit is not that high frequecy, try use inductor on PCB.

As a rule of thumb, 1mm length of a bond wire has approximately 1nH inductance.

yeah Vfone , but the repatiabltiy and reliability of the bond wire is not o controlled

and need a acurate model of the bond wire , and i thnk it will take some effort to simulate the bondwire with EM simulator

khouly

I don?t understand what means accurate model for a bond wire.
Today we have very accurate models for complex nonlinear circuits and we cannot have for a piece of wire?

All the basic models that I?ve used for bond wires works fine for me in VCO?s, PA?s, on-module filters, or other circuits designs.

so u just use the simple model of the bondwire , and it is good , or u need to use em simulator to simulate it

khouly

How do we use it for simulation ? S2P files or otehr format ? THnaks

if u mean the output of the EM simulator , it will be S parameter file , u can include it in ur simulation

khouly

Hi, All:

Yes. Many people consider it is 1 nH per mm. It si a good approximation. I did check it more precisely. It is about 0.8 nH per mm. Also, it will change with wire radius and the shape. However, it is not very sensitive. The more concerned part is the mutual coupling. I have not seen any good guess for it. Using EM simulators to model it is a good choice. You can use IE3D for it. By the way, I work for Zeland. It is not very time consuming to model wire bonds on IE3D. If it is a simple wire bonds, it takes at most seconds per frequency point. For the IE3D V12, we also have the FastEM design kit can yield real-time results for even multiple coupled wire bonds. IE3D V12 should be out next week. Please check it.

Best regards,

Jian