How to consider the IO pad's equivalent model including bondwire and analog pad
时间：04-11
整理：3721RD
点击：
A packaged chip need receive a high frequency(1.1GHz),sine wave,low swing(peak to peak=0.3v) signal from external. How to consider the IO pad's equivalent model including bondwire(Au wire between analog pad and pin) and analog pad in chip? My design is based on TSMC0.25 mixed signal process, what are the parameters of this IO pad's equivalent model roughly?
Or would anybody recommend any materials or papers about this issue?
Thank you very much!
Or would anybody recommend any materials or papers about this issue?
Thank you very much!
equivalent pad IO 相关文章：
- What is RLC equivalent circuit of cavity resonator, Series or parallel RLC?
- Need transistor equivalent
- L-C loaded left handed metamaterial....equivalent circuit Cr Lr Cl Ll
- Equivalent Noise Bandwidth
- Equivalent circuit for TE, TM propagation modes
- Equivalent circuit of a dielectric resonator coupled to a microstrip line