About bondwire

I am a freshman in bondwire.So some questions here.
Why bondwire is suitable to connect transmission line with MMIC Chips?
what is the effect of connection,and common circuit model of it?
Any good refences?

Thanks

Liu

Hello,

small electronics with big features is creating ongoing demands for miniaturized integrated circuits (ICs) with ever more inputs and outputs. This results in very crowded connections between tiny ICs and their packages. As a consequence, the lead wire bonding ? used to form those connections

Good references
U. Goebel, ?DC to 100 GHz Chip-to-
Chip Interconnects with Reduced Tolerance
Sensitivity by Adaptive Wirebonding,?
pp182-185, IEEE 3rd Topical Meeting
on Electrical Performance of Electronic
Packaging, November 1994.

Hai-Young Lee, ?Wideband
Characterization of a Typical Bonding
Wire for Microwave and Millimeter-Wave
Integrated Circuits,? IEEE Trans. On MTT,
Vol. 43, No 1, pp 63-68, January 1995.
T. Krems, W. Haydl, H. Massler, J.
Rudiger, ?Millimeter-Wave Performance of
Chip Interconnections Using Wire Bonding
and Flip Chip,? IEEE MTT-S Digest, pp 247-
250, 1996.

Grover, F.W., Inductance Calculations, Mineola, New York: Dover Publishing, 2004

Bahl, I.J., Lumped Elements for RF and Microwave Circuits, Norwood, MA: Artech House, 2003

Bond Wire Modeling Standard. EIA/JEDEC Standard EIA/JESD59: Electronics Industries Association, June 1997.


---manju---