how to determine bondwire parameters

i have a packaged ic and i need to find out the length of the bond wires used inside the package, how do i find those ? also there are vias inside the package will they have considerable inductances so that they affect the performanec of the ic? but more importantly how do i find the exact parameters , length etc of the bondwires?

Have a look at the data sheet for lead inductances.
There are methods to open (plastic) packages, and then you may have a look with a microscope.
The most comfortable way would be to x-ray the package. If you do it in 3D and have a suitable calibration, you might figure out the bond wire length.

A few nH are typical for standard packages.

X-Ray may be used to take photo of package inside.Then you can measure bondwire length.
The electrical parameters are only found by simulating within 3D EM simulation environment.But it is also pretty complex because the bondwires may not be uniform as you wish..