pa output matching
时间:04-09
整理:3721RD
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Hi frieds,
We use MMIC (die) with PA integrated. Power of PA is supplied exterior, and I firstly measure the impedance (for bonding wire) and match to 50 Ohm. I hear that somebody said matching needs to be done without DC component .So I have a question: whether can i use VNA directly connect to MMIC PA output without DC decouple (My VNA: 8753E~+26dBm RF, 30VDC max) and the measure result is correct?
Another question, if I want to measure 32dBm RF signal using the same VNA, how can I measure the output impedance of PA?
Thanks,
We use MMIC (die) with PA integrated. Power of PA is supplied exterior, and I firstly measure the impedance (for bonding wire) and match to 50 Ohm. I hear that somebody said matching needs to be done without DC component .So I have a question: whether can i use VNA directly connect to MMIC PA output without DC decouple (My VNA: 8753E~+26dBm RF, 30VDC max) and the measure result is correct?
Another question, if I want to measure 32dBm RF signal using the same VNA, how can I measure the output impedance of PA?
Thanks,
Its better to use load pull technique. Take care that you will protect the VNA from PA DC(with AC couple).
You can use a pad to measure 32dBm as VNA can not handle this much power.
http://www.sirenza.com/documents/new...rn_Loss_Of.pdf
Thanks for kspalla's and vfone's help.Datasheet gives me Zlopt,and because it is die IC,the bonding wire and the PCB trace will impact the matching to 50 Ohm,Should i do load pull test or use VNA to measure the impedance that changed by adding bonding wire and trace,and then match to 50Ohm?
If the output power is in the VNA input range you can use the VNA.
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