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有IC设计相关的职位需求,可以联系我,职位多多。。。

时间:12-12 整理:3721RD 点击:
目前有效的职位:
深圳:
模拟电路设计工程师/经理(ADC PLL Serdes 各种高速高精度方向 3年+工作经验)
数字电路设计工程师/经理(asic, FPGA,SOC等数字前端设计都可以,3年+工作经验)
高级算法工程师/经理(指纹识别 图象处理、计算机视觉、模式识别等,3+工作经验)
sales marketing Director (被动元器件产品,有国内手机客户小米 中兴 华为 联想等客户资源)
销售总监(维护过联想的PC业务/维护过中兴华为的手机业务)
资深销售(FPGA方向)
  
上海:
模拟设计(电源管理方向)
RF设计(PLL方向)
视频架构工程师
Windows驱动软件开发工程师
数字前端设计(视频编解码或者数模混合方向)
通信算法,Wifi驱动软件,GPS导航算法等
资深FAE(FPGA芯片方向)
数字后端 90nm以下
资深数字设计经理(高速异步设计)
BSP软件设计工程师
SOC设计经理
  
北京:
数字后端设计(90nm或以下工艺)
SOC验证工程师
基带算法工程师(LTE/WIFI)
模拟设计经理(PLL/ADC/存储)
销售经理(FPGA方向)
销售经理/总监(维护过联想的PC业务)
CPU硬件/软件设计
  
南京:
资深SOC/ASIC设计(通信领域)
算法工程师(通信领域)
模拟工程师(ADC /RF。。常规模拟都OK)
销售/经理(通信芯片 RF)
数字设计工程师
  
西安:
高级ID设计师 (手机方向)
  
有兴趣想了解的朋友可以私信我,或者发邮件至我的邮箱,doris.zhang@engageway.com
微信/电话:18221188734
  
北京招聘高lever职位
一. 高性能计算软件工程师/经理:熟悉高性能计算的原理、方法,有实际编程经验。
   (1)偏底层汇编语言算法,64位CPU优先,X86,ARM的也可以考虑
   (2)HPC应用算法,C语言,MPI语言
  
二. 资深CPU设计工程师/经理:熟悉CPU架构和指令体系,熟悉编译器原理。
三、Post: Machine Learning Expert(机器学习算法工程师,博士或优秀的硕士)
Job Description:
1. Development and implementation of DL/ML algorithms focusing on industrial applications, such as, driver-less cars, robotics, internet of things, and industry 4.0.
2. Strategy development for the field of AI/DL/ML, support in strategic decision making with regard to our various product lines.
3. Development of large scale DL/ML algorithms and parallel implementation strategies.
4. Evaluation and comparison of DL/ML algorithms for specific applications and related tasks, in particular with regard to the performance, training, and suitability for embedded applications;
5. Close communication with our hardware architecture experts.

Competencies and Qualifications:
1. PhD in computer science, artificial intelligence, mathematics, physics, statistics.
2. Expertise and practical experience in the following domains: Artificial Intelligence, Deep Learning, Machine Learning. Practical experience in CNN/NLP algorithm is a plus.
3. In-depth practice in deep learning methodologies on GPU/FPGA/ASIC, such as Caffe, ConvNet, Torch…etc., mastering the tuning strategy for CNN/NLP's parameters.
4. Technical proficiency in programming languages: R, C/C++, Python, Matlab, Java, JavaScript, familiarity with Linux environment.
5. Experience with big data technologies and HPC is a plus, such as Hadoop ecosystem.
6. Excellent communicative skills in read and written English, fluent spoken English.
7. Strong communication skills, ability to express oneself logically, strong sense of team spirit, proactive communication

上海封装相关职位: 薪水可谈
  
Director B/E Process Engineering  
Min 15 years of IC industry backend assembly process engineering experience with good English communication & leadership capability
Moldng(注塑成型)—CP Filling(点胶)—Laser Marking(镭射)—Saw(切割)—Sputter(溅渡)(B/E)
  
Sr. Manager/Director Molding Process Engineering  
Min 12 years of direct IC molding process engineering experience with proven capability in developing new molding process & trouble shooting molding problems
  
Director Equipment Engineering (Molding)
Min 15 years of direct IC equipment PM experience with good understanding of TPM principle and past success in the implementation
他们用的设备机台是飞科,Fico.AMS~W系列
  
有兴趣的朋友请把简历发至:doris.zhang@engageway.com
T/微信:18221188734
QQ:925476710

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