Xilinx汽车电子控制单元ECU开发方案

Xilinx（赛灵思）公司的汽车（XA）电子控制单元（ECU）开发套件是基于赛灵思公司满足汽车应用标准的低成本Xilinx XA Spartan-3E 现场可编程门阵列（FPGA）器件。XA 汽车 ECU套件为快速开发车内网络、信息娱乐、辅助驾驶以及驾驶信息系统提供了一个平台。它该套件包括一个带有预工程化硬件接口的开发板，支持众多汽车应用IP。利用这一完整的开发环境，汽车设计人员可快速完成器件评估，迅速完成设计并开始运行。本文介绍了Xilinx的Spartan-3E FPGA系列主要性能，以及汽车电子ECU 开发套件 (HW-XA3S1600E-UNI-G)的主要性能和方框图。

赛灵思汽车（XA）电子控制单元（ECU）开发套件是基于赛灵思公司满足汽车应用标准的低成本Xilinx XA Spartan-3E 现场可编程门阵列（FPGA）器件。XA 汽车 ECU套件为快速开发车内网络、信息娱乐、辅助驾驶以及驾驶信息系统提供了一个平台。

XA汽车ECU开发套件。该套件包括一个带有预工程化硬件接口的开发板，支持众多汽车应用IP。利用这一完整的开发环境，汽车设计人员可快速完成器件评估，迅速完成设计并开始运行。

XA 汽车 ECU开发套件提供了开发完整子系统所需要的所有元器件，包括配有一片XA Spartan-3E 160万系统门FPGA的XA1600E开发板，板上硬件接口，如CAN 2.0B 和 C、Ethernet 10/100、USB 2.0、SPI 和 SCI。预先验证的赛灵思和第三方应用IP为开发MOST 系统、FlexRay 连接以及高速和低速CAN总结接口提供了必要的构建模块。该套件还包括一个带有通用适配器的电源、编程和定制串行电缆、快速入门指南以及包含方便评估的参考设计的资源CD。同时还支持赛灵思嵌入式开发套件和ISE设计工具评估版。

关于XA Spartan-3E FPGA

XA Spartan-3E FPGA系列满足大批量成本敏感汽车电子应用要求。该系列的五款器件提供从10万至160万系统门不同密度和不同封装组合。XA器件同时提供扩展温度范围Q-Grade (-40°C 至 +125°C Tj) 和 I-Grade (-40°C 至 +100°C Tj)器件，并且符合业界公认的AEC-Q100标准。与此前的器件相比，这些90nm器件单位美元成本提供了更多功能和I/O带宽，在可编程逻辑行业确立了新标准。由于其超低成本，XA Spartan-3E FPGA提供了优异的替代解决方案，避免了ASIC和ASSP的高掩膜成本和长开发周期。

一．Spartan-3E FPGA系列

The Spartan-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.
The five-member family offers densities ranging from 100,000 to 1.6 million system gates.The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration.
These Spartan-3E enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.

The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.

Spartan-3E FPGA系列主要特性：

Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO interface pins
- Up to 376 I/O pins or 156 differential signal pairs
- LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
- 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
- 622+ Mb/s data transfer rate per I/O
- True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
- Enhanced Double Data Rate (DDR) support
- DDR SDRAM support up to 333 Mb/s
Abundant, flexible logic resources
- Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
- Efficient wide multiplexers, wide logic
- Fast look-ahead carry logic
- Enhanced 18 x 18 multipliers with optional pipeline
- IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM memory architecture
- Up to 648 Kbits of fast block RAM
- Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
- Clock skew elimination (delay locked loop)
- Frequency synthesis, multiplication, division
- High-resolution phase shifting
- Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
- Low-cost, space-saving SPI serial Flash PROM
- x8 or x8/x16 parallel NOR Flash PROM
- Low-cost Xilinx Platform Flash with JTAG
Complete Xilinx ISE and WebPACK development system support
MicroBlaze and PicoBlaze embedded processor cores
Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
Low-cost QFP and BGA packaging options
- Common footprints support easy density migration
- Pb-free packaging options