Difference between matallization and solid plane!

In a paper,the difference characteristics of three kinds of ground plane were described.I wonder what's the difference between matallization and solid ground plane.In my mind,they are the same just with the difference of name.Would somebody like to tell me that!TKS!

A solid copper ground plane is just that - a board layer of continuous copper with nothing else - no components or traces.

Metalization refers to pouring a local area of copper on a layer that has other signal traces or components present. Sometimes it is a complete covering of copper on the exterior layers of a board, with voids to allow the placement of components. Sometimes it is a local pour of copper on a layer directly under a layer with components or traces that require special impedance, or other ground return requirements. Sometimes it is a copper pour on the same layer adjacent to traces or componets requiring special ground return or shielding.