lg bond

Hi,

Can any one help me in choosing Lg in a source degenerated LNA. Can I design complete Lg with the on chip spiral inductor? Or depending on the package I use, do I need to have the value of the inductance of the bond wire of the package? How do I simulate the bond wire inductance in cadence software?

Yes you need to model the bond wire too.
I am not aware of cadence.

Thanks for the reply. Do we need to model the bond wire based on the length and thickness of the bondwire used in the package? Any idea what are typical values of the bond wires in the 68 pin CQFP packages?

Yes.
I am not aware.

You can contact packaging house for an estimation of the bond wire parameters.
packaging houses like Amkor and Unisem will give you the basic parameters (but not the entire model) for the package you are using.