封装的温度建模一般用什么软件？
时间：12-12
整理：3721RD
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请教版上大神
ANSYS Sentinel-TI
Sentinel-TI is a thermal simulation and mechanical stress integrity analysis
platform for SoC and stacked-die/3D-IC designs. Through comprehensive modeling
and simulation, Sentinel-TI enables engineers to accurately predict the
thermal behavior of the chip and package, including its impact on chip-package
reliability and stress.
原Apache DA的
