TCS2315 GPRS手机解决方案

                  Other system-level cost reduction features include the ability
                  of TCS2305 and TCS2315 solutions to support a full 128 x 160,
                  65-k color display with no additional external SRAM memory.
                  Circuitry for power management for phone peripherals like
                  headsets and battery charging is also integrated on-chip to
                  further reduce costs by lowering chip count.

                  Integrating TIs innovative DRP RF architecture into the
                  TCS2305 and TCS2315 solutions add another dimension to
                  lowering the cost of a mobile phone. DRP technology applies
                  digital techniques to simplify radio frequency processing and
                  dramatically cuts the cost and power consumption of
                  transmitting and receiving information wirelessly. Processing
                  radio signals with digital logic can significantly simplify
                  the implementation and enhance the scalability of wireless
                  communications capabilities.

                  By integrating DRP technology into the LoCosto family of
                  wireless solutions, functions that were previously implemented
                  in discrete devices have now been combined in a single-chip
                  solution. With the RF section included in one device, space
                  requirements and component counts are reduced. At the same
                  time, interconnects are minimized, greatly improving the
                  handset is reliability.

                  By digitizing analog functionality, testability and