0.13um Tape out (fabrication) check list

Hi
I will be fabricating a chip in TSMC 0.13um. Chip has RF front end working at 3.1-10.6GHz. This is my 1st tape out and I would like to know all the things I should be careful off before fabrication. I have done DRC and LVS which is clean. Also I have done RLC Extraction and post extraction simulations. What other things I should be doing? Should I be worried about EMI,EMC,ESD? Please let me know

Thanks in advance