to put lumped inductor between two microstrip lines in HFSS

hi there
i am trying to simulate a structure having lumped inductor in HFSS. i have to put lumped inductor between two microstrip lines of certain thickness. i tried with joining them through a plate and RLC boundary over it but obtained result is not satisfactory.
i have attached the HFSS structure , required result and obtained result

any comments or suggestion would be really helpful.

build a box of vacuum across the 2 lines, define it as a inductance. The integration line should contact the 2 MS lines.

Added after 1 minutes:

The box could be just above the MS lines, and have contact with the MS lines.

hi james thanks for replying . your statements 1)The box could be just above the MS lines
2)The integration line should contact the 2 MS lines.
are bit confussing. plz expalin the 1st statement bit more clearly .
thanks in advance

If you have HFSS and Designer available you might want to consider co-simulating where you build the traces with HFSS and combine them in Designer with the inductor.

I would speak with one of the application engineers for the details.

Regards

ya i have both software pls expalin me how to co - simulate

Added after 44 minutes:

hi james cook
i made the structure as per ur instruction .....pls check weither i have done everything correct or not ....but still result is not the required result

here is a HFSS expample.hope to clarify...

thanks james
this ckt will give me more confidance in designing structure

i just want to know as u have put the vaccum box above microstrip line so why there is need to draw box a sheet would have done the work .
when i said box in between microstrip line i meant a box structure between two lines not above them any way if this the way then fine i will go along with it

if u have anything else to tell me regarding this pls do tell me

The vaccum box with lumped RLC can repsent a chip capacitor, chip inductor or chip resistor on the MS line. The box size should be of the package size.