Compensation of Bond Ribbon and matching!
时间：03-31
整理：3721RD
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Hi,
I have been using two bond-ribbons to connect XYZ-chip to my dp951 LTCC module, which worked fine within limits. However, now when I tried to use only one ribbon, I am facing some problems.
First the chip is manufactured with 40Ohm I/O impedance (found from measurements) while my desire is to connect the chip to substrate with microstrip mode with 50Ohm impedances.
The ribbon is connected to a wide microstrip pad on dp951. The pad has to be then connected to 50-Ohm microstrip line. Therefore, there is somehow mismatch! In order to have impedance matching I used different ways to compensate for both reactive part from ribbon/pad and the impedance matching. But the solution is not very broadband in simulation and measurements!
The second constraint is of Area which should not exceed 400 or 450microns on top layer.
anyone who has already worked with such problems, please do share!
regards,
saqib
I have been using two bond-ribbons to connect XYZ-chip to my dp951 LTCC module, which worked fine within limits. However, now when I tried to use only one ribbon, I am facing some problems.
First the chip is manufactured with 40Ohm I/O impedance (found from measurements) while my desire is to connect the chip to substrate with microstrip mode with 50Ohm impedances.
The ribbon is connected to a wide microstrip pad on dp951. The pad has to be then connected to 50-Ohm microstrip line. Therefore, there is somehow mismatch! In order to have impedance matching I used different ways to compensate for both reactive part from ribbon/pad and the impedance matching. But the solution is not very broadband in simulation and measurements!
The second constraint is of Area which should not exceed 400 or 450microns on top layer.
anyone who has already worked with such problems, please do share!
regards,
saqib