surface meshing at metallic vias
时间：03-26
整理：3721RD
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Hi everybody,
I am simulating a structure similar to the well-known mushroom, in HFSS v.10. Somebody told me I could save processing time if I apply a condition like "surface meshing" at the vias but I was not able to find this option.
Does this option really exist? or do I have to give a conductive boundary condition at each via instead of assigning a metallic material?
Than you in advance.
Edgar.
I am simulating a structure similar to the well-known mushroom, in HFSS v.10. Somebody told me I could save processing time if I apply a condition like "surface meshing" at the vias but I was not able to find this option.
Does this option really exist? or do I have to give a conductive boundary condition at each via instead of assigning a metallic material?
Than you in advance.
Edgar.