成都美资公司急需数字后端工程师（内推）
成都美资公司急需数字后端工程师（内推），工作地点在成都,邮箱地址是mapjohnlee@sina.com
以下是JD：
Job Description:
1.
Cooperate with logical engineers for product spec definition
2.
Hands on chip physical designs from netlist to GDSII, including floor planning, power planning, Place & Route, CTS, power analysis, timing closure, cross talk analysis, and physical verification
3.
Hands on IP/IO layout design
4.
Create/maintain/optimize chip physical design flow
Requirements:
1.
One year or above work experience in chip APR and silicon tape-out
2.
Bachelor or above degree of Microelectronics or Electronic and Information Engineering
3.
Have thorough knowledge on CTS, STA and cross talk analysis
4.
Good knowledge on CMOS device structure, process technology, EMI/EMS, latch-up, ESD
5.
Familiar with physical design EDA tools (Cadence, Synopsys, Mentor), Unix/Linux environment
6.
Low power design and CPF/UPF experience is a plus
7.
Good scripting skill in C-shell, Perl and Tcl
8.
Good verbal and written English communication skill
想问一下大神，后端的就业前景如何啊?有人说是个模拟版图一样，体力活而已。还是想问一下的，以后的薪资待遇之类的。谢谢啊！
朋友，关于行业前景你可以网上了解下，如果有兴趣，可以先发简历过来哈
小编你好，请问有一年多后端实习经验的应届生可以接受么?
应届优秀的也可以的，把简历发过来看看
能留个邮箱么
UPF有加分啊。哈哈。
忘了留邮箱了，请大家发邮件到mapjohnlee@sina.com
部门headcount 增加了，现在还需要数字后端若干名，请大家抓住机会哈。速发中英文简历到mapjohnlee@sina.com