高速PCB单端过孔研究

Hz、10.99 GHz、10.92 GHz，第三次谐振频率分别为12.66 GHz、12.52GHz和12.39 GHz。

4、结论

通过对过孔设计参数孔径、过孔长度、焊盘/反焊盘尺寸进行优化可有效提高过孔阻抗连续性。当过孔长度小于1.0 mm时，可通过对这4个设计参数进行优化，将过孔引起的阻抗变化控制在10%以内。为过孔信号提供返回路径，可实现对过孔阻抗的控制，并能降低过孔的信号损耗。采用4个接地参考孔时，过孔阻抗可通过同轴电缆阻抗公式近似计算。多余短柱会导致过孔阻抗降低，损耗增加。

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作者简介 王红飞，博士，2010年6月毕业于中山大学高分子化学与物理专业，后进入广州兴森快捷电路科技有限公司，现为技术中心技术开发部研发工程师，主要从事高速PCB阻抗控制及高频/高速PCB制作研究。

来源：兴森科技微信号