铺铜时出现这样的报告是怎么回事
时间：10-02
整理：3721RD
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大家好！我用的是PADS2007,有时候我在做完LAYOUT后铺铜时出现这样的报告，如下；
THERMAL RELIEF ERRORS REPORT -- WD04569aF3-0.pcb -- Tue Apr 10 16:09:27 2012
Drilled pads with Nondrilled pads with
less than 50% thermal extensions less than 50% thermal extensions
Report of Thermal Spokes Generator.
On Bottom:
C12.2 (36.9, 6.025) # = 1
C9.2 (11.5024, 6.5) # = 1
Total Drilled pads: 0 Total Nondrilled pads: 2
请问大家这是哪里有错误呢。请各位指教！
THERMAL RELIEF ERRORS REPORT -- WD04569aF3-0.pcb -- Tue Apr 10 16:09:27 2012
Drilled pads with Nondrilled pads with
less than 50% thermal extensions less than 50% thermal extensions
Report of Thermal Spokes Generator.
On Bottom:
C12.2 (36.9, 6.025) # = 1
C9.2 (11.5024, 6.5) # = 1
Total Drilled pads: 0 Total Nondrilled pads: 2
请问大家这是哪里有错误呢。请各位指教！
你的问题我以前也遇到过，pads layout里tools->options->thermals的菜单下，有关于设置贴片焊盘和插件焊盘接地使得的铜箔线的宽度和数量，注意min.spoke项，铺铜的时候你的C12.2和C9.2的接地铜的铜箔线数量应该是少于你设置min.spoke的值，才会出现这个问题的吧！