If multiple vias required on VCC
时间:04-08
整理:3721RD
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Hi,
In my PCB design,
Layer 1: Top Layer (RF Signals)
Layer 2: Mid 1 Layer (GND Plane)
Layer 3: Mid 2 Layer (Power tracks in star configuration)
Layer 4: Bottom Layer (Signals and GND plane)
Should I give multiple vias for Vcc pads in top layer to connect them to inner power routing, the same way where we use multiple vias for GND connection to create low impedance path?
Cheers,
In my PCB design,
Layer 1: Top Layer (RF Signals)
Layer 2: Mid 1 Layer (GND Plane)
Layer 3: Mid 2 Layer (Power tracks in star configuration)
Layer 4: Bottom Layer (Signals and GND plane)
Should I give multiple vias for Vcc pads in top layer to connect them to inner power routing, the same way where we use multiple vias for GND connection to create low impedance path?
Cheers,
No, not unles there is so much current flowing in one (1 amp for instance) that you think there will be a big voltage drop or it might vaporize.
I would run multiple via connections between your two ground planes, spaced all over the board. You do not want energy leaking to the backside and making bottom ground layer to resonate at some frequency.
Rich
www.maguffinmicrowave.com
Hi
I attached via current calculator
this spreadsheet will give number of vias you need.
Also I agree with Biff no to much vias in VCC
In RF GND yes but not in VCC
David
