What is the height and thickness of NELCO N4000-11 FR4 substrate

Dear Sir,
I need the FR4 NELCO company N4000-11 substrate electrical parameters(such as ε_r,H,T,TanD). I have searched the NELCO company and found out the N4000-11, got the information about relative permittivity (ε[SUB]r[/SUB=4.1 at 1GHz] and tangential loss(TanD=0.012). I couldn't find out thickness of conductor deposition on the substrate( T) and height of the substrate (H).

Can you any body help me to find out , NELCO company FR4 substrate N4000-11 HEIGHT("H") of the substrate and THICKNESS("T") of the conductor deposition.

There's no problem and no question to answer. The substrate will be manufactured in industry standard thickness, with or without copper lamination. Ask your PCB manufacturer for available types.

FvM Sir,
But, whenever we are using "MLIN" in ADS software, we must use the "MSUB". There we must specify the H= thickness of the substrate and T= cladding of copper, Er= relative permittivity and TanD= Tangential loss. As I said earlier, we must need H and T for simulation purpose, when we use MLIN in the circuit.
But I downloaded some datasheets of FR4 NELCO, ISOLA LAMINATES, ARLON companies. They gave only about the Er and TanD, nowhere they have given about the "H" and "T".
How to get the "H" and "T" any company FR4 substrate.

These are general material datasheets, valid both for prepreg and laminates. Just choose a common geometry like 35 μ copper and 1 or 1.6 mm substrate for two-layer. As already said, you will find usual board stack-ups specified by PCB manufacturers.

FvM Sir,
Thank you for your reply.
As you said , we must ask PCB manufacturer for the "H" thickness of the substrate and "T" thickness of cladding copper for any company FR4 substrate.

Respectively you can chose it for your design out of the available types.