How to handle via in hi-frequency multilayer board

We want to develop some hi-frequency multilayer board components.The frequency is high enough that we have to build the component with microstrip line or stripline.But when it come to the vias,we really don't know how to handle them during our design.What effect they will do to the performance of our boards?I'm really at a loss.Can anybody help me,Thanks very much!

Hi

You could be able to find the relevant materials here: Via inductance/capacitance return current path, connecting layer etc.
http://www.sigcon.com/pubschron.htm

Regards,

Via will change the impedance of the line, so a part of the energy of the signal will reflect bact to the signal source. The effect of the via is mainly capacitive, but also
inductive to a lesser extent.
Shortly:
-Make vias as short as possible
-Make them as thin as possible

This is just a short outline, you will need to read more about it.