您好，请问 SN65MLVD206 焊接温度

您好，请问SN65MLVD206焊接温度是多少?用机器焊接不能正常工作，人工取下，手工焊接，产品正常工作，谢谢!

器件指标书上有给出焊接工艺要求：

MSL Peak Temp

Level-1-260C-UNLIM

如果不能满足这个要求，手工焊接是有风险的。

TI 芯片的焊接曲线是完全符合Jedec 020D的要求的

看一下这个页面

http://processors.wiki.ti.com/index.php/Package_Reflow_Profiles

TI device is fully comcpliance with Jedec 020D. And for peak temp enquirt, pls refer to below link:

http://focus.ti.com/quality/docs/prdcntsearch.tsp?templateId=5909&navigationId=11220

220 C/ 235 C for devices with lead as content (pb soldering process)

250 C / 260 C for devices which are pb less (pb free soldering process)

不良率是多少，请按照JEDEC标准进行操作