IPC-2226-2003 高密度互连(HDI)印制板设计分标准

IPC-2226
Sectional Design
Standard for High
Density Interconnect
(HDI) Printed Boards
Developed by the HDI Design Subcommittee (D-41) of the HDI
Committee (D-40) of IPC
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
1 SCOPE
This standard establishes requirements and considerations
for the design of organic and inorganic high density interconnect
(HDI) printed boards and its forms of component
mounting and interconnecting structures.
1.1 Purpose The requirements contained herein are
intended to establish design principles and recommendations
that shall be used in conjunction with the detailed
requirements of IPC-2221. In addition, when the core
material reflects requirements identified in the sectional
standards (IPC-2222, IPC-2223, IPC-2224 and IPC-2225),
that information becomes a mandatory part of this standard.
The standard provides recommendations for signal, power,
ground and mixed distribution layers, dielectric separation,
via formation and metallization requirements and other
design features that are necessary for HDI-advanced IC
interconnection substrates. Included are trade-off analyses
required to match the mounting structure to the selected
chip set.
IPC-2226-2003 高密度互连(HDI)印制板设计分标准.pdf

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