EMC Design Guide for Printed Circuit Boards
时间：10-02
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PART I: PREFACE................................................................................................................ 8
1. INTRODUCTION .................................................................................................................. 8
PART II: GENERAL EMC................................................................................................ 9
2. EMC OVERVIEW.................................................................................................................. 9
2.1. The Elements .................................................................................................................. 9
2.2. The Environment .......................................................................................................... 10
2.3. Regulations and Standards............................................................................................ 11
2.4. Elements of EMI........................................................................................................... 12
PART III: DESIGN APPROACH.................................................................................... 14
3. OVERVIEW........................................................................................................................ 14
3.1. Design Approach for Immunity (Susceptibility) .......................................................... 14
3.1.1. Design Approach for Radiated Immunity ............................................................. 14
3.1.2. Design Approach for ESD..................................................................................... 14
3.2. Design Approach for Controlling Radiated and Conducted Emissions........................ 14
3.3. Ground System.............................................................................................................. 15
3.4. Wavelength and Frequency........................................................................................... 19
3.5. Frequency Domain of Digital Signals........................................................................... 22
3.6. Radiated Emissions Predictions.................................................................................... 24
3.7. Crosstalk ....................................................................................................................... 28
3.7.1. Common Impedance Coupling..............................................................................29
3.7.2. Capacitive and inductive coupling ........................................................................ 30
3.7.3. Capacitive coupling ...............................................................................................30
3.7.4. Inductive coupling .................................................................................................33
3.8. Twisted Pair .................................................................................................................. 36
3.9. Shielding ....................................................................................................................... 37
3.10. Resistance..................................................................................................................... 40
3.11. Inductance .................................................................................................................... 41
PART IV: IC RE MEASUREMENT PROCEDURE.................................................. 46
4. SCOPE................................................................................................................................. 46
4.1. Applicable Documents.................................................................................................. 46
4.2. EMC Test Recommendations ....................................................................................... 47
4.3. Test Procedure Applicability ........................................................................................ 47
4.4. IC Emissions Reference Levels .................................................................................... 48
4.4.1. Level 1 ................................................................................................................... 49
4.4.2. Level 2 ................................................................................................................... 49
4.4.3. Level 3 ................................................................................................................... 49
4.4.4. Level 4 ................................................................................................................... 50
4.4.5. Level NR................................................................................................................ 50
4.5. Data Submission ........................................................................................................... 50
4.6. Radiated and Conducted Immunity .............................................................................. 50
PART V: EMC DESIGN GUIDELINES FOR PCB.................................................. 51
5. GENERAL........................................................................................................................... 51
5.1. Board Structure/Ground Systems ................................................................................. 52
5.2. Power Systems .............................................................................................................. 57
5.3. Digital Circuits.............................................................................................................. 61
5.4. Analog Circuits ............................................................................................................. 64
5.5. Communication Protocols............................................................................................. 65
5.6. Shielding ....................................................................................................................... 65
5.7. Miscellaneous ............................................................................................................... 67
PART VI: REQUIREMENTS........................................................................................... 69
6. MANAGEMENT OF CHANGE FOR EMC ....................................................................... 69
6.1. Radiated Immunity: ...................................................................................................... 69
6.1.1. For safety critical systems (containing one or more Class C functions) ............... 69
6.1.2 For non-safety critical systems.............................................................................. 70
6.2. Conducted immunity:.................................................................................................... 70
6.3. Electrostatic Discharge ................................................................................................. 70
6.4. Conducted Emissions:................................................................................................... 71
6.4.1 CE420 Frequency domain ..................................................................................... 71
6.4.2 CE410 Time Domain............................................................................................. 71
PART VII: CHECKOFF LIST ........................................................................................ 72
7. CHECKOFF LIST – EMC DESIGN GUIDE FOR PCB(S) ................................................ 72
EMC Design Guide for Printed Circuit Boards.pdf
1. INTRODUCTION .................................................................................................................. 8
PART II: GENERAL EMC................................................................................................ 9
2. EMC OVERVIEW.................................................................................................................. 9
2.1. The Elements .................................................................................................................. 9
2.2. The Environment .......................................................................................................... 10
2.3. Regulations and Standards............................................................................................ 11
2.4. Elements of EMI........................................................................................................... 12
PART III: DESIGN APPROACH.................................................................................... 14
3. OVERVIEW........................................................................................................................ 14
3.1. Design Approach for Immunity (Susceptibility) .......................................................... 14
3.1.1. Design Approach for Radiated Immunity ............................................................. 14
3.1.2. Design Approach for ESD..................................................................................... 14
3.2. Design Approach for Controlling Radiated and Conducted Emissions........................ 14
3.3. Ground System.............................................................................................................. 15
3.4. Wavelength and Frequency........................................................................................... 19
3.5. Frequency Domain of Digital Signals........................................................................... 22
3.6. Radiated Emissions Predictions.................................................................................... 24
3.7. Crosstalk ....................................................................................................................... 28
3.7.1. Common Impedance Coupling..............................................................................29
3.7.2. Capacitive and inductive coupling ........................................................................ 30
3.7.3. Capacitive coupling ...............................................................................................30
3.7.4. Inductive coupling .................................................................................................33
3.8. Twisted Pair .................................................................................................................. 36
3.9. Shielding ....................................................................................................................... 37
3.10. Resistance..................................................................................................................... 40
3.11. Inductance .................................................................................................................... 41
PART IV: IC RE MEASUREMENT PROCEDURE.................................................. 46
4. SCOPE................................................................................................................................. 46
4.1. Applicable Documents.................................................................................................. 46
4.2. EMC Test Recommendations ....................................................................................... 47
4.3. Test Procedure Applicability ........................................................................................ 47
4.4. IC Emissions Reference Levels .................................................................................... 48
4.4.1. Level 1 ................................................................................................................... 49
4.4.2. Level 2 ................................................................................................................... 49
4.4.3. Level 3 ................................................................................................................... 49
4.4.4. Level 4 ................................................................................................................... 50
4.4.5. Level NR................................................................................................................ 50
4.5. Data Submission ........................................................................................................... 50
4.6. Radiated and Conducted Immunity .............................................................................. 50
PART V: EMC DESIGN GUIDELINES FOR PCB.................................................. 51
5. GENERAL........................................................................................................................... 51
5.1. Board Structure/Ground Systems ................................................................................. 52
5.2. Power Systems .............................................................................................................. 57
5.3. Digital Circuits.............................................................................................................. 61
5.4. Analog Circuits ............................................................................................................. 64
5.5. Communication Protocols............................................................................................. 65
5.6. Shielding ....................................................................................................................... 65
5.7. Miscellaneous ............................................................................................................... 67
PART VI: REQUIREMENTS........................................................................................... 69
6. MANAGEMENT OF CHANGE FOR EMC ....................................................................... 69
6.1. Radiated Immunity: ...................................................................................................... 69
6.1.1. For safety critical systems (containing one or more Class C functions) ............... 69
6.1.2 For non-safety critical systems.............................................................................. 70
6.2. Conducted immunity:.................................................................................................... 70
6.3. Electrostatic Discharge ................................................................................................. 70
6.4. Conducted Emissions:................................................................................................... 71
6.4.1 CE420 Frequency domain ..................................................................................... 71
6.4.2 CE410 Time Domain............................................................................................. 71
PART VII: CHECKOFF LIST ........................................................................................ 72
7. CHECKOFF LIST – EMC DESIGN GUIDE FOR PCB(S) ................................................ 72
EMC Design Guide for Printed Circuit Boards.pdf
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