IPC-2222-1998 刚性有机印制板设计分标准
时间：10-02
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ANSI/IPC-2222
Sectional Design
Standard for Rigid
Organic Printed Boards
Developed by the IPC-D-275 Task Group (D-31b) of the Rigid Printed
Board Committee (D-30) of IPC
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
FOREWORD
This standard is intended to provide information on the detailed requirements for organic rigid printed board design. All
aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements
of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic materials
(metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and
mechanical components.
The information contained herein is intended to supplement generic engineering considerations and design requirements
identified in IPC-2221. When coupled with the engineering design input, the complete disclosure should facilitate the appropriate
selection process of the materials and the detailed organic rigid structure fabrication technology necessary to meet the
engineering design objectives.
The selected component mounting and interconnecting technology for the printed board should be commensurate with the
requirements provided and the specific focus of this sectional document.
IPC’s documentation strategy is to provide distinct documents that focus on specific aspect of electronic packaging issues.
In this regard document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0).
Included in the set is the generic information which is contained in the first document of the set and identified by the four
digit set number. The generic standard is supplemented by one or many sectional documents each of which provide specific
focus on one aspect of the topic or the technology selected. The designer of the printed board, needs as a minimum, the
generic, the sectional of the chosen technology, the generic engineering considerations, and the engineering description of
the final product.
Failure to have all information available prior to starting a design may result in a product that is difficult to manufacture or
exceeds the cost predictions or expectations of the printed board.
As technology changes, specific focus standards will be updated, or new focus standards added to the document set. The
IPC invites input on the effectiveness of the documentation and encourages user response through completion of ‘‘Suggestions
for Improvement’’ forms located at the end of each document
IPC-2222-1998 刚性有机印制板设计分标准.pdf
Sectional Design
Standard for Rigid
Organic Printed Boards
Developed by the IPC-D-275 Task Group (D-31b) of the Rigid Printed
Board Committee (D-30) of IPC
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
FOREWORD
This standard is intended to provide information on the detailed requirements for organic rigid printed board design. All
aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements
of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic materials
(metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and
mechanical components.
The information contained herein is intended to supplement generic engineering considerations and design requirements
identified in IPC-2221. When coupled with the engineering design input, the complete disclosure should facilitate the appropriate
selection process of the materials and the detailed organic rigid structure fabrication technology necessary to meet the
engineering design objectives.
The selected component mounting and interconnecting technology for the printed board should be commensurate with the
requirements provided and the specific focus of this sectional document.
IPC’s documentation strategy is to provide distinct documents that focus on specific aspect of electronic packaging issues.
In this regard document sets are used to provide the total information related to a particular electronic packaging topic. A
document set is identified by a four digit number that ends in zero (0).
Included in the set is the generic information which is contained in the first document of the set and identified by the four
digit set number. The generic standard is supplemented by one or many sectional documents each of which provide specific
focus on one aspect of the topic or the technology selected. The designer of the printed board, needs as a minimum, the
generic, the sectional of the chosen technology, the generic engineering considerations, and the engineering description of
the final product.
Failure to have all information available prior to starting a design may result in a product that is difficult to manufacture or
exceeds the cost predictions or expectations of the printed board.
As technology changes, specific focus standards will be updated, or new focus standards added to the document set. The
IPC invites input on the effectiveness of the documentation and encourages user response through completion of ‘‘Suggestions
for Improvement’’ forms located at the end of each document
IPC-2222-1998 刚性有机印制板设计分标准.pdf
学习一下。
好资料。
好东西,谢谢分享,
写得不错，下载收藏了。
非常感谢！
真是好资料。
学无止境！
内容抽空看看，顶个
不错，学习一下。
非常感谢。
好东西。
这个很好哦，谢谢