EMC设计首要考虑的10个因素

EMC设计首要考虑的10个因素 Top 10 EMC Design Considerations
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Ashish Kumar and Pushek Madaan， Cypress
作者：Ashish Kumar和Pushek Madaan，赛普拉斯半导体
With the increasing demand for high-speed circuits， PCB design is becoming significantly more challenging. Along with design of the actual logic on the PCB， engineers have to consider several other aspects that affect the circuit like power consumption， PCB size， environment noise， and EMC. The following guidelines will describe how hardware engineers can address EMC issues during the PCB design phase to a system free of EMC faults.(
随着高速电路需求的日益增加，PCB设计变得越来越富有挑战性。除了PCB的实际逻辑设计，工程师还必须考虑其他几个影响电路的方面，如功耗、PCB大小、环境噪声、以及电磁兼容（EMC）。本文将介绍硬件工程师如何在PCB设计阶段解决电磁兼容问题，使系统不受电磁干扰影响。

1.

1. Ground Planes – A low inductance ground system is the most vital element when designing a PCB for minimizing EMC. Maximizing the ground area on a PCB reduces the inductance of ground in the system， which in turn reduces electromagnetic emissions and crosstalk.

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铺地层 —— 在进行PCB板设计时低感应系数的接地系统对于最小化EMC来说是最重要的元素。最大化PCB铺地面积可以减少系统中铺地自感应，从而减少电磁辐射和干扰。

1. Signals can be connected to ground using different methods. A poor PCB design is one where components are connected randomly to ground points. Such a design generates high ground inductance and leads to unavoidable EMC issues.

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信号可以用不同的方法连接到地。一个比较差的PCB设计就是器件随便地连接到接地点。这样的设计会产生高的自感应，从而导致不可避免的EMC问题。

1. A recommended design approach is to have a full ground plane as it provides the lowest impedance as the current returns back to its source. However， a ground plane requires a dedicated PCB layer which may not be feasible for two-layer PCBs.
   
2. In such case， designers are recommended to use ground grids as shown in Figure 1a. The inductance of ground in this case will depend on the spacing between the grids.

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推荐的设计方法是，用一整层铺地，这是因为电流回到源端时阻抗很低。然而，专门有一层来铺地对于两层PCB来说是不切合实际的。在这种情况下，建议设计者们使用如图1所示的铺地网格。在这种情况下地的自感应取决于网格之间的距离。

1. The way a signal returns to system ground is also very important because when a signal takes a longer path， it creates a ground loop which forms an antenna and radiates energy. Thus， every trace carrying current back to the source should follow the shortest path and must go directly to the ground plane. Connecting all the individual grounds and then connecting them to the ground plane is not advisable because it not only increases the size of current loop but also increases the probability of ground bouncing.
   
2. Figure 1b shows the recommended method of connecting components to the ground plane.

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信号连接到系统地的方式也很重要，因为当信号路径过长，它就构成了一个地环路，会形成天线和辐射能量。因此，每一个载流回源线迹都应遵循最短路径，必须直接连接地平面。连接单个的地，然后将它们连接到铺地平面是不可取的，因为它不仅增加了电流环路的尺寸，而且还提高了ground bouncing的概率。图1 b显示了器件连接到地平面的推荐方法。

1. Using a Faraday’s cage is another good mechanism for reducing the problems caused by EMC. A Faraday cage is formed by stitching the ground on the complete periphery of the PCB and not routing any signal outside this boundary (see Figure 1c). This mechanism restricts the emission/interference from/to the PCB within/outside the boundary defined by the cage.

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使用法拉第笼是另一个可以减少EMC引起问题的不错机制。法拉第笼构成是这样的，在整个PCB边界打一些小孔连接到地，边界外面不布任何信号 (参见图1 c)。这一机制可以制约来自定义的笼里面PCB的辐射/干扰，并阻止笼外面的辐射/干扰影响PCB。
2.

1. Component Segregation – For an EMC-free design， components on the PCB need to be grouped according to their functionality， such as analog， digital， power supply sections， low-speed circuits， high-speed circuits， and so on. The tracks for each group should stay in their designated area. For a signal to flow from one subsystem to another， a filter should be used at subsystem boundaries.

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器件隔离 —— 对于一个没有电磁干扰的设计，PCB上的元器件需要按照功能分组，如模拟、数字、电源部分，低速电路、高速电路等。每组的布线应该保持在指定的区域。对于从一个子系统流到另一个子系统的信号，应该在子系统的边界放一个滤波器。
3.

1. Board Layers – Proper arrangement of the layers is vital from an EMC point of view. If more than two layers are used， then one complete layer should be used as a ground plane. In the case of a four-layer board， the layer below the ground layer should be used as a power plane (Figure 2a shows one such arrangement). Care must be taken that the ground layer should always be between high-frequency signal traces and the power plane. If a two-layer board is used and a complete layer of ground is not possible， then ground grids should be used.
   
2. If a separate power plane is not used， then ground traces should run in parallel with power traces to keep the supply clean.

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板层 —— 从EMC角度来看，PCB板层结构尤为重要。如果PCB超过两层，那么应该有一个整层用来铺地。在四层板的情况下，铺地层下面应是电源层(图2a显示了这种结构)。必须注意，在高频信号和电源层之间应该有铺地层。如果为双层板设计，不可能有整个铺地层，那么应该使用铺地网格。如果不是独立的电源层，那么应该使用地线和电源线平行来保持供电干净。
4.

1. Digital Circuits – When dealing with digital circuits， extra attention must be given to clocks and other high-speed signals. Traces connecting such signals should be kept as short as possible and be adjacent to the ground plane to keep radiation and crosstalk under control. With such signals， engineers should avoid using vias or routing traces on the PCB edge or near connectors. These signals must also be kept away from the power plane since they are capable of inducing noise on the power plane as well.
   
2. While routing traces for an oscillator， apart from ground no other trace should run in parallel or below the oscillator or its traces.
   
3. The crystal should also be kept close to the appropriate chips.

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数字电路 —— 在处理数字电路时，需要特别注意时钟和其他高速信号。连接此类信号的走线应保持尽可能短，并靠近铺地层以保持辐射和干扰在控制之下。对于这种信号，工程师应避免使用过孔或者在PCB边缘和靠近连接器的位置走线。这些信号应该远离电源层，因为它们也会在电源层产生噪声。
当给晶振布线时，除了地，其他任何走线都不能与时钟线平行或布在晶振下面。晶体还应该尽量靠近需要时钟的器件。

1. It is also worth noting that return current always follows the least reactance path.
   
2. Therefore， ground traces carrying return current should be kept close to the trace carrying its associated signal to keep the current loop as short as possible.
   
3. Traces carrying differential signals should run close to each other to most effectively use the advantage of magnetic field cancellation.

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值得一提的是，电流返回总是沿着阻抗最低的路径。因此，承载返回电流的地线应和相关的信号布线尽量靠近，以保持电流环路尽可能地短。
差分信号布线应该尽可能靠近对方，最有效地利用磁场抵消的优势。
5.

1. Clock Termination – Traces carrying clock signals from a source to a device must have matching terminations because whenever there is an impedance mismatch， a part of the signal gets reflected. If proper care is not provided to handle this reflected signal， larges amount of energy will be radiated. There are multiple forms of effective termination， including source termination， end termination， AC termination， etc.

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时钟匹配 —— 从源端到器件的时钟线必须完全匹配，因为每当有阻抗失配的情况下，就会有部分信号反射。如果没有适当处理反射信号，就会有很大的能量辐射出去。有很多种有效的匹配方式，包括源端匹配，终端匹配，AC匹配等。
6.;

1. Analog Circuits – Traces carrying analog signals should be kept away from high-speed or switching signals and must always be guarded with a ground signal. A low pass filter should always be used to get rid of high-frequency noise coupled from surrounding analog traces. In addition， it is important that the ground plane of analog and digital subsystems not be shared.

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模拟电路 —— 模拟信号走线应远离高速信号和开关信号，必有地信号保护。应该用低通滤波器来去除与周围模拟走线耦合的高频噪声。此外，重要的是要使模拟地和数字地子系统分开。
7.

1. Decoupling Capacitor – Any noise on the power supply tends to alter the functionality of a device under operation. Generally， noise coupled on the power supply is of a high frequency， thus a bypass capacitor or decoupling capacitor is required to filter out this noise. A decoupling capacitor provides a low impedance path for high-frequency current on the power plane to ground. The path followed by the current as it travels toward ground forms a ground loop. This path should be kept to a minimum possible level by placing a decoupling capacitor very close to the IC (see Figure 2b).
   
2. A large ground loop increases the radiation and can act as a potential source of EMC failure.

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去耦电容 —— 任何电源噪声往往都会改变处于工作状态下设备的功能。一般来说，电源耦合噪声频率比较高，因此需要一个旁路电容或去耦电容来滤除这种噪声。去耦电容为电源层上的高频电流提供了一个到地的低阻路径。电流到地的路径形成了一个地环路。这个路径应尽可能短，要把去耦电容放在离IC尽可能近的地方(见图2 b)。大的地环路会增加辐射，会成为一个潜在的EMC错误源。

1. The reactance of an ideal capacitor approaches to zero with increasing frequency. However， there is no such thing as an ideal capacitor available on the market.3
   
2. In addition， the lead and the IC package add inductance as well. Multiple capacitors with low ESL (Equivalent Series Inductance) should be used to improve the decoupling effect.

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随着频率增加，理想电容的电抗会接近零。然而，这是不可能的，市场上没有这样理想的电容。此外，铅和IC封装也会增加电感。应该用多个低ESL (等效串联电感)电容来改进去耦效果。
8.

1. Cables – Most EMC-related problems are caused by cables carrying digital signals that effectively act as an efficient antenna. Idealy， the current entering a cable leaves it at the other end. In reality， parasitic capacitance and inductance emit radiation. Using a twisted pair cable helps keep coupling to a low level by cancelling any induced magnetic fields. When a ribbon cable is used， multiple ground return paths must be provided. For high-frequency signals， shielded cable must be used where the shielding is connected to ground both at the beginning and at the end of the cable.

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电缆 —— 多数EMC相关问题都是由携带数字信号的电缆引起的，它就像一个天线。想象一个理想情况，电流进入一个电缆把它留在另一端。事实上，寄生电容和电感会发出辐射。使用双绞线电缆有助于保持较低耦合，去除任何感应磁场。当使用带状电缆时，必须提供多个地返回路径。对于高频信号，必须使用屏蔽电缆，在电缆的两头都要屏蔽到地。
9.

1. Crosstalk – Crosstalk can exist between any two traces on a PCB and is a function of mutual inductance and mutual capacitance proportional to the distance between the two traces， the edge rate， and the impedance of the traces. In digital systems， crosstalk caused by mutual inductance is typically larger than the crosstalk caused by mutual capacitance. Mutual inductance can be reduced by increasing the spacing between the two traces or by reducing the distance from the ground plane.

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串扰 —— 串扰可能存在于PCB上两条走线之间，它是关于互电感和互电容的函数，和两条走线之间的距离、边沿变化率和走线阻抗成正比。在数字系统中，由互电感产生的串扰通常大于由互电容产生的串扰。可以通过增加走线之间的距离或减少与铺地的距离来减小互电感。
10.

1. Shielding – Shielding is not an electrical solution but a mechanical approach to reducing EMC. Metallic packages (conductive and/or magnetic materials) are used to prevent EMI from escaping the system. A shield may be used either to cover the whole system or a part of it， depending upon the requirements. A shield is like a closed conductive container connected to ground which effectively reduces the size of loop antennas by absorbing and reflecting a part of their radiation. In this way， a shield also acts as a partition between two regions of space by attenuating the radiated EM energy from one region to another. A shield reduces the EMI by attenuating both the E-Field and H-field component of radiating wave.

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屏蔽 —— 屏蔽并非电子解决方案，而是机械方式来减少EMC。可以用金属罩(导电和/或磁性材料)来防止EMI跑出这个系统。可以是屏蔽整个系统或它的一部分，这取决于实际需求。屏蔽就像一个封闭的导电容器连接到地，通过吸收和反射辐射的一部分，有效地减小了环形天线的尺寸。用这种方法，通过衰减从一个区域到另一个地方辐射的电磁能量，屏蔽还可用来划分两个空间区域。通过衰减辐射波电场和磁场，可以减少电磁干扰。

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中英对照，这个资料好嘞。