请教VIP technology

现发现客户要求 Via Fill: Board uses VIP technology.All laser vias on SMT lands to be filled, planarized and plated with non-conductive via fill per IPC-6016.
请问VIP technology是什么技术?
后面用非导电的塞孔可以用阻焊么?还是用树脂?
请高人解答！