Do you know about TSV sizing?

Hi,

I am trying to model TSV in HFSS. I have no idea about TSV sizing in different technologies. Do you know any reference or document including the size of the TSVs in different CMOS technologies(especially 180n and 65n)?

Thank you in advance

As far as I know TSV is not related to the CMOS technology as they are two different processes. One example of TSVs I have worked with were 50 μm in diameter (non-filled). Wafer thickness was generally <200 μm because of low etch rates. Material was tungsten, about 1 μm thick.