Pads for MMWave/RF in Digital Process

I am using a digital process to design MMWAVE and RF circuits.

I need to design pads (for G S G probing).

This is for over ten GHz.

Any resources, papers or thesis on designing pads for these applications?

You don't have too much choice..Read the Probe Manufacturer's Guide and place your pads.
This a mechanical constraint, you cannot place your pads as you wish..

@BigBoss,

Thanks for your reply.

First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on.

But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs.

Thank you.

You have to surely use most upper layer .. Isn't it logical ?

@BigBoss, thanks for your reply.

Yes, I am aware of this.

Here is a paper screenshot - 65nm CMOS Pads for MMWave Applications.

Look the sectional view on the left and the top view on the right.

Question is - the pads on the right and left of the top view - those are just connected to ground or what are they connected to (the ground pads).

Yes, ground pads are connected to the substrate.

You should block dummy metal fill under the signal pad.