siwave s parameter convert

I am looking for info on macromodel. I am working on power delivery analysis for IC application. Info needed is how to construct macromodel from parasitic model extracted by EM solver be it an S, Y or Z parameter. I need to construct macromodel for package and motherboard and run Hspice for time domain analysis like transient to simulate for noise on Power distribution network. I have heard there are some software like PRIMA and HiPRIME that I can use for this purpose but don't know where to find them. Thanks.

Hi, riz_aj:

Most of the 2D/2.5D/3D EM solvers have the capability to convert S-parameters to spice compatible models. For example: Ansoft HFSS, SpiceLink, TPA; CST Microwave Studio, IE3D, Sonnet, EMtoSpice, ADS etc.

I like to use Agilent ADS Spice model generator since it has the capability of generating spice compatible models for different topologies(Pi, T, Ladder)which can give the insight into the physical meanings of the structures under study. Those spice models with fixed topologies are usually narrow band which cannot represent you S-parameters faithfully, thus you need to choose Hspice macromodel for broadband model generation.

I've ever tried to look for some freewares that can do this job but found nothing. Please share with me such resources, if any.

Thanks and best regards,

Hi smithchart,

I've been reading a lot papers from folks at Georgia Tech Packaging Research Center. In their papers they never revealed their actual software that they use to convert S-parameter to macromodel. I've a feeling that they must use some mathetical analysis software like Mathlab or Mathematica since their approach is so math-centric. I can share with you their papers if you are interested. Feel like writing to them asking how they actually do it but afraid they might not want to reveal it.

For high frequency chip package electrical performance evaluation, there are lots of successful examples by using HFSS or CST MWS, I dont know Georgia Tech Packaging Research Center using what kind of software, I believe both HFSS and CST can do this job excellently. Some good samples you can search the website of Ansoft, EMI/EMC on PCB, some nice examples and presentation given by Intel staff can be found. But for signal integrity analysis, another software from AnSoft, named SiWave is proper, it can analyze whole multilayer package, but the drawback is the solver is base on 2.5D simulation, and it can not provide radiation field calculation.
Best Regards,