版图中通孔的个数会不会影响寄生电容？

和Cap没有关系吧

通孔多了会使寄生电容增加的，高速信号的路径，通孔不要太多太密！

其实最好的办法就是你做一小块电路去比较一下，实践得真知

应该是通孔多，寄生电容变小，主要是金属板重叠面积减小，寄生减小

A ---------------
||
C1==R1
||
|- || -|
|C3|
C2==R2
||
||
B ---------------
dumped eqvalent impedance between plate A and B.
R1 and R2 is resistance of via.
C1 and C2 is vertical parastice capacitance between A and B.
C3 is parastice laternal capacitance between several via.
Premise : another via pattern do not have to exist around AB overlap area.
the More via, the more C3.
But, idealy for proper frequency, if R1=R2 and C1=C2,
then we can say V(C)=V(D).
So we can ignore C3 for simplicity.
if R1=R2=R/2, C1=C2=C/2
Between A and B, equvalent impedance Z = R || (1/sC)

R1 = R0/k (k : the number of via)
resistance will be decrease with directly propotitionnal to the nubmer of via.
C1 = C0*(1-k*r) ( r : via area / original overlap area )
capacitance will be propotional with overlap area between A and B.
But it must substract via area.So as more via, as capacitance will be decrease.
Z = R / (1 + sCR) -> low pass function.
Fc = 1/(2pi*Tc)
Tc = R*C = R0*C0*(1/k-r)
As more via, TC decrease and then Fc will be increase.
So for high frequecy, we need more via and small area of A and B.

没听说过这种理论，via当然多一点好，阻抗小，电容增加?这个忽略不计。

via 和寄生电感有点关系，Cap可以忽略

分析的很好，总体而言，via越多，寄生电阻越小，寄生电容越小；

自己画几个通孔密度不同的版图，用电磁场工具仿真即可验证。

请教，电磁场工具是什么?