TPS65053RGER (epoxy void)

Hi ,

We have done 2pcs a X-RAY for this item, and found inside there is an epoxy void both inside the parts. please see photos attach.

i want to know if this happens in QFN package, and is it normal? will it infect the function? what percentage room will be considering as a normal? 

Please help and advise.
Thanks a lot,

Apple

有两种可能 ： 1，没有cure，直接W/B,  因为W/B 有P－H：200，所以没有出现掉片的现象 ；
                    2，epoxy用到每一针筒的尾端，epoxy含有较多的胶油，所以cure是产生void.

i want to know if this happens in QFN package, and is it normal? will it infect the function? what percentage room will be considering as a normal? 

The DB is more, the problem of WB how much is your temperature? How much is the temperature of the DB? Less glue will have this kind of situation, DB amount adjustment and material, the machine model of the DB is what. The thickness of the glue will influence is the largest. You this kind of situation estimation and less glue, the DB pressure too, do not believe you can do a test。。

 if this happens in QFN package，  it is normal。。