HDC2010 底部PCB Layout

HDC2010 的传感元件位于器件底部，请问下，这种PCB Layout在HDC2010底部是怎么处理？是打一个大孔？还是做焊盘接地？

看看官方手册的参考

请参考datasheet 有关10.1 layout guideline部分的介绍：http://www.ti.com/lit/ds/symlink/hdc2010.pdf

It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device (GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.