Package design (signal integrity) engineer - staff or seni
时间：12-12
整理：3721RD
点击：
Package design (signal integrity) engineer -- staff or senior staff level
Required Experience: MSEE plus over 5 years’ industry experience or equivalent
Responsibilities:
Silicon Image is looking for an experienced package design (signal integrity) engineer. The responsibility will include, but are not limited to:
- Package design coordination and management
- Interact with and support chip design to enable silicon architecture development
- Perform cross-functional team design reviews
- Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
- Package design flow methodology implementing power distribution network (PDN) constraints for high speed interface
- QFP/QFN and BGA package design considering signal integrity and power integrity
- Package model generation using 3D full wave simulation tool and correlation with test result
Required skills:
MS in EE plus over 5 years of industry experience or equivalent is required.
Should be familiar with basic circuit theory, microwave, package design and high speed interconnect signal integrity.
Experience with signal integrity and circuit simulation tools such as ADS, HFSS and HSPICE is highly preferential.
Also experiences with measurement equipment such as high speed scope, spectrum analyzer, network analyzer, etc. are desirable.
A team player and self-motivated with good communication skills.
Strong oral and written English communication capabilities.
有意者请邮件联系：jerry.ke@siliconimage.com。请在标题里标注申请封装设计工程师（信号完整性）职位。
Required Experience: MSEE plus over 5 years’ industry experience or equivalent
Responsibilities:
Silicon Image is looking for an experienced package design (signal integrity) engineer. The responsibility will include, but are not limited to:
- Package design coordination and management
- Interact with and support chip design to enable silicon architecture development
- Perform cross-functional team design reviews
- Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
- Package design flow methodology implementing power distribution network (PDN) constraints for high speed interface
- QFP/QFN and BGA package design considering signal integrity and power integrity
- Package model generation using 3D full wave simulation tool and correlation with test result
Required skills:
MS in EE plus over 5 years of industry experience or equivalent is required.
Should be familiar with basic circuit theory, microwave, package design and high speed interconnect signal integrity.
Experience with signal integrity and circuit simulation tools such as ADS, HFSS and HSPICE is highly preferential.
Also experiences with measurement equipment such as high speed scope, spectrum analyzer, network analyzer, etc. are desirable.
A team player and self-motivated with good communication skills.
Strong oral and written English communication capabilities.
有意者请邮件联系：jerry.ke@siliconimage.com。请在标题里标注申请封装设计工程师（信号完整性）职位。
@earthmouse 好像很长时间没来本版了
我来了，最近太忙，水母站务太二逼，搞得意兴阑珊，现在混
朋友圈和QQ群更多。
那工作好像适合你
本版好像就你一个人搞封装