美资500强工业控制集团招聘手机产品机械设计师（ME Engineer）
时间：10-02
整理：3721RD
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POSITION SUMMARY
As a Mechanical Engineer for HSM, the individual will be responsible for the design and development of mechanical components, parts, and assemblies that define enclosures for portable industrial computer products and peripherals. Additional responsibilities will include testing products to ensure conformance to specifications, and support of products throughout production.
PRINCIPAL RESPONSIBILITIES
List and describe this position’s key responsibilities in concise, comprehensive statements. Address what the position holder does to achieve the position’s main purpose. Also check the approximate amount of time spent on each Area of Responsibility. Time should be expressed relative to 100%.
Area of Responsibility[/COLOR]
1. Mechanical Design
Provide design changes to existing products
Develop mechanical specifications, designs, parts, assemblies, and final products
Work closely with Hardware Engineering and Industrial Design
Interface with program management
2. Design partner support
Make visits to our design partners to help with production issues and to ensure products are manufactured and designed properly
3. Technical problem resolution
Prepare feasibility reports
Make technical recommendations
Field issue validation
4. Professional development
Keep informed on the latest state-of-the art devices, techniques and technical developments and theories associated with the Mechanical Engineering discipline
KNOWLEDGE, SKILLS AND ABILITIES
Education level and/or relevant experience(s)[/COLOR]
Bachelors Degree in Mechanical Engineering
Knowledge and skills (general and technical) [/COLOR]
Pro /Engineer - Required
Intralink
Ansys or Pro/Mechanica
Microsoft Office
Experience with injection molding
Thorough understanding of materials, particularly plastics
Working knowledge of electronic, mechanical and materials design theory
Experience with new product development of consumer or industrial portable electronics products
Other requirements [/COLOR]
Fluent communication skills in English both verbal and written
补充几点：
工作地点：苏州工业园区
薪资待遇：1年13薪+2-3个月的绩效奖金+车贴+苏州工业区标准的四金福利（国内最高）+额外医疗保险
注意事项：英文可以做技术口头交流，面试中会有美国总部的英文电话面试环节
发展目标：目前是一个全新的团队，这个BU将会发展新一代智能手机平台下手持条形码扫描设备系统
本人联系方式如下：
电子邮件：bill@21cnmanager.com
QQ：5667805
msn: jialei.liu@hotmail.com
Gtalk: jialei.liu@gmail.com
As a Mechanical Engineer for HSM, the individual will be responsible for the design and development of mechanical components, parts, and assemblies that define enclosures for portable industrial computer products and peripherals. Additional responsibilities will include testing products to ensure conformance to specifications, and support of products throughout production.
PRINCIPAL RESPONSIBILITIES
List and describe this position’s key responsibilities in concise, comprehensive statements. Address what the position holder does to achieve the position’s main purpose. Also check the approximate amount of time spent on each Area of Responsibility. Time should be expressed relative to 100%.
Area of Responsibility[/COLOR]
1. Mechanical Design
Provide design changes to existing products
Develop mechanical specifications, designs, parts, assemblies, and final products
Work closely with Hardware Engineering and Industrial Design
Interface with program management
2. Design partner support
Make visits to our design partners to help with production issues and to ensure products are manufactured and designed properly
3. Technical problem resolution
Prepare feasibility reports
Make technical recommendations
Field issue validation
4. Professional development
Keep informed on the latest state-of-the art devices, techniques and technical developments and theories associated with the Mechanical Engineering discipline
KNOWLEDGE, SKILLS AND ABILITIES
Education level and/or relevant experience(s)[/COLOR]
Bachelors Degree in Mechanical Engineering
Knowledge and skills (general and technical) [/COLOR]
Pro /Engineer - Required
Intralink
Ansys or Pro/Mechanica
Microsoft Office
Experience with injection molding
Thorough understanding of materials, particularly plastics
Working knowledge of electronic, mechanical and materials design theory
Experience with new product development of consumer or industrial portable electronics products
Other requirements [/COLOR]
Fluent communication skills in English both verbal and written
补充几点：
工作地点：苏州工业园区
薪资待遇：1年13薪+2-3个月的绩效奖金+车贴+苏州工业区标准的四金福利（国内最高）+额外医疗保险
注意事项：英文可以做技术口头交流，面试中会有美国总部的英文电话面试环节
发展目标：目前是一个全新的团队，这个BU将会发展新一代智能手机平台下手持条形码扫描设备系统
本人联系方式如下：
电子邮件：bill@21cnmanager.com
QQ：5667805
msn: jialei.liu@hotmail.com
Gtalk: jialei.liu@gmail.com
顶起来呀~~~~
每日一顶！