IMU-3000中间的Exposed PAD不要焊？

IMU-3000是一个Gyroscope芯片， 看它的datasheet上面写着 “Do not solder the center pad”， 中间那个pad不要焊接的话，要不要在板上画出来呢?那个有啥用?应该不是用来散热的吧?

要焊接，那句话的意思是不要绿油层solder mask,在PCB中亮铜就可以了

是这么个意思?我还以为是不要焊接！

可是，它的datasheet中有这么一段话： The IMU-3000 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the die.
是不是不要焊接上去阿?