针对复杂微波结构的新型高频材料

罗杰斯(Rogers)公司Advanced Circuit Materials(ACM)部门即将在2009年1月19日至20日美国圣地亚哥举办的IEEE Radio & Wireless Symposium上，展出其最新的RT/duroid 高频材料和RO3000/RO4000层压板。

即将展出的RT/duroid材料包括RT/duroid 5000和RT/duroid 6002、以及最新的RT/duroid系列高频材料(RT/duroid 6202PR)，它主要用于设计复杂的微波结构，如天线和需要层间互连的多层电路。

RT/duroid 6202PR可提供与RT/duroid 6202相同的电气和机械性能，此外，当覆盖一层阻性铜箔时，它还能用作容差很小的平面电阻。

其他展示的产品将包括Rogers广泛使用的商业级RO3000和RO4000层压板。更多信息请访问该公司网站www.rogerscorp/acm.

Rogers Corporation (NYSE:ROG ), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance specialty material products for a variety of applications in a wide range of markets including: portable communications, consumer products, communication infrastructure, ground transportation, and aerospace and defense. Most of the Company's products are covered by trade secrets or patents.

Rogers operates manufacturing facilities in Arizona, Connecticut, and Illinois in the U.S., in Gent, Belgium and in Suzhou, China.

Asian sales offices are located in Japan, China, Taiwan, Korea, India and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics Co., Ltd. and in the U.S. with Mitsui Chemicals, Inc. The world runs better with Rogers.