微波EDA网,见证研发工程师的成长!
首页 > 研发问答 > 微波和射频技术 > 天线设计和射频技术 > How to take ESD and pad capacitances into consideration during design

How to take ESD and pad capacitances into consideration during design

时间:04-04 整理:3721RD 点击:
Hi, If I want to take Capacitance effects of ESD and bond pad in the design. Where should I connect these capacitances, at every pin in the schematic?. Also, Where exactly ESD protection circuit is connected, only at the input?

Thanks

Connect them to ground, it is enough. ESD is normally at the direct input of the chip and builded into the pad between input & VDD/VSS, sometimes secondary ESD is implemented at the gates which are connected to pins and very sensitive. I am not an expert, but high frequency ESD model (I guess you need this) is capacitance to ground on circuit inputs. I wouldn't overthink it when the focus is on other circuit's design.

Copyright © 2017-2020 微波EDA网 版权所有

网站地图

Top