1.4 的协议栈 和1.3的协议栈 区别在那些地方

1.4 的协议栈 和1.3的协议栈 区别在那些地方  做了几个月工程的1.3协议栈了 现在是否要移植到1。4上做做

安装好协议栈后，协议栈路径下面的“说明”应该有

- This version of the Texas Instruments BLE stack and software is a minor 
update to the v1.3.2 release. It contains some minor bug fixes and a few 
functional changes.

- The BLE protocol stack, including both the controller and host, was 
completely retested for v1.4.0.

Changes and Enhancements:

- All projects have been migrated from IAR v8.10.4 to IAR 8.20.2. In order to
build all projects, be sure to upgrade to IAR v8.20.2.

- Updated SPI and UART_DMA drivers for improved robustness and throughput.

- Added an overlapped processing feature to improve throughput and reduce power
consumption in devices where peak power consumption isn't an issue. Overlapped processing allows the stack to concurrently process while the radio 
is active. Since the stack is concurrently processing, it is able to insert 
new data in the Tx buffer during the connection event, causing additional 
packets to be sent before the end of the event.

- Added a Number of Completed Packets HCI command which offers the possibility 
of waiting for a certain number of completed packets before reporting to the 
host. This allows higher throughput when used with overlapped processing.

- Added an HCI Extension command HCI_EXT_DelaySleepCmd which provides the user 
control of the system initialization sleep delay (wake time from PM3/boot 
before going back to sleep). The default sleep delay is based on the 
reference design 32 kHz XOSC stabilization time.

- Added a low duty cycle directed advertising option.

- Added support for deleting a single bond with the GAP_BondSetParam command.

- Decreased CRC calculation time during OAD by using DMA.

Bug Fixes:

- Using a short connection interval and exercising high throughput, there was 
some loss of packets. This was fixed by adding host to application flow control support.

- Bonding was unstable at short connection intervals. This is now fixed.

- Fixed USB CDC Drivers to work with Windows 8.

- OAD sample project would fail if long connection interval was used. This was fixed by not allowing parameter updates to the central device.

- Fixed linking errors in UBL project.

- Fixed minor issues in sample apps to work with PTS dongle.

- Fixed USB descriptors in HostTestRelease to display correct string.

Known Issues:

- Use of the NV memory (to save application data or BLE Host bonding
information) during a BLE connection may cause an unexpected disconnect.
The likelihood of this happening increases with frequent usage, especially
when using short connection intervals. The cause is related to the NV wear
algorithm which at some point may cause an NV page erase which can disrupt
system real-time processing. It is therefore recommended that the NV memory
be used sparingly, or only when a connection is not active.

- HCI packet size of 128 bytes or more will be disregarded by the stack, and as 
such, no HCI event will be returned.

楼上正解，BLE的安装文件夹内是有相关说明的 README.txt

也可以参考TI主页的说明  http://www.ti.com.cn/tool/cn/ble-stack

BLE-Stack 1.4.0 的新软件功能包括：

• 重叠处理 – 允许该堆栈在无线电处于活动状态时并行处理。由于该堆栈能够并行处理，因此可以在连接事件期间将新数据插入 Tx 缓冲区，使得能够在事件结束之前发送更多数据包，进而提升系统吞吐量。 
• 改进无线固件下载 (OAD) – 在 OAD 完成后加快对固件映像的验证速度。这一点与重叠处理特性相结合可进一步提高吞吐量。
• 改进 SPI 和 UART 驱动程序 – 为使用 UART 和 SPI 接口（尤其是在用于电源管理和/或在网络处理器模式下使用时）改进了 HAL（硬件抽象层）驱动程序的稳健性。