穿通型器件和非穿通型器件工作原理

我是新手，近日接触到了穿通型器件和非穿通型器件的概念。请问穿通型器件和非穿通型器件的设计思想、工作原理各是什么?有什么区别?

punch throung that is depletion all the minu area and get to density
NPT is that depletion area did not reach the edge of the silicon and breakdown
take place.

呵呵，谢谢小编，不过请问小编，get to density 什么意思啊?还有这两种器件各自的优点是什么呢?谢谢小编。